Helium and hydrogen plasmas interaction with Si3N4 and SiO2 materials for advanced etch applications : A molecular dynamics study - Université Grenoble Alpes Accéder directement au contenu
Communication Dans Un Congrès Année : 2023

Helium and hydrogen plasmas interaction with Si3N4 and SiO2 materials for advanced etch applications : A molecular dynamics study

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hal-04511394 , version 1 (19-03-2024)

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  • HAL Id : hal-04511394 , version 1

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E. Despiau-Pujo, V. Martirosyan, F. Pinzana, C. Petit-Etienne, F. Leverd, et al.. Helium and hydrogen plasmas interaction with Si3N4 and SiO2 materials for advanced etch applications : A molecular dynamics study. 13th Plasma Etch and Strip in Microtechnologies workshop (PESM), Jun 2023, Grenoble, France. ⟨hal-04511394⟩
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