(Invited) Water Transport Along Si/Si Direct Wafer Bonding Interfaces
Résumé
The transport of water in a highly confined gap made by the direct
bonding of low roughness silicon hydrophilic wafers is studied.
We derive the equation for the transport of water from chemical
potential gradients, using Stokes and conservation equations. The
transport equation is found to be a Porous Medium Equation with
exponent 2. A solution for this equation with stepwise boundary
conditions is given. The model is tested against different initial
conditions for inward and outward flow, and different temperatures
and humidity levels.