Fracture Dynamics during the Silicon Layer Transfer of the Smart Cut Process - Université Grenoble Alpes
Communication Dans Un Congrès Année : 2014
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hal-02015910 , version 1 (12-02-2019)

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D. Massy, F. Mazen, J. Ragani, F. Madeira, D. Landru, et al.. Fracture Dynamics during the Silicon Layer Transfer of the Smart Cut Process. 13th International Symposium on Semiconductor Wafer Bonding - Science, Technology and Applications as part of the 226th Meeting of the Electrochem Soc, ECS, Oct 2014, Cancun, Mexico. pp.13-20, ⟨10.1149/06405.0013ecst⟩. ⟨hal-02015910⟩
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