Etching Mechanisms of Si Containing Materials in Remote Plasma Source using NF3 based Gas Mixture - Université Grenoble Alpes Accéder directement au contenu
Communication Dans Un Congrès Année : 2018

Etching Mechanisms of Si Containing Materials in Remote Plasma Source using NF3 based Gas Mixture

Fichier non déposé

Dates et versions

hal-01942770 , version 1 (03-12-2018)

Identifiants

  • HAL Id : hal-01942770 , version 1

Citer

E. Pargon, V. Renaud, C. Petit-Etienne, L. Vallier, G. Tomachot, et al.. Etching Mechanisms of Si Containing Materials in Remote Plasma Source using NF3 based Gas Mixture. 65th International AVS Symposium & Topical Conferences, Oct 2018, Long Beach, United States. ⟨hal-01942770⟩
43 Consultations
0 Téléchargements

Partager

Gmail Facebook X LinkedIn More