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hal-01021831v1
Communication dans un congrès
I. Radu, G. Gaudin, W. Van den Daele, F. Letertre, C. Mazure et al. Novel low temperature 3D wafer stacking technology for high density device integrationEuropean solid-state circuits conference (39 ; 2013 ; Bucharest, Romania). 43rd ESSDERC, Sep 2013, Bucarest, Romania. IEEE,cop. 2013, Piscataway (N.J.), pp.151-154, 2013, Proceedings of the European Solid State Device Research Conference. <10.1109/ESSDERC.2013.6818841>
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