Fracture Dynamics during the Silicon Layer Transfer of the Smart Cut Process

D. Massy 1 F. Mazen 2 J. Ragani 3 F. Madeira 4 D. Landru 1 F. Rieutord 3
1 SOITEC SA
2 LTM - Laboratoire des technologies de la microélectronique
3 NRS - Nanostructures et Rayonnement Synchrotron
MEM - Modélisation et Exploration des Matériaux : DRF/IRIG/MEM
4 CEA-LETI - Laboratoire d'Electronique et des Technologies de l'Information
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Conference papers
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http://hal.univ-grenoble-alpes.fr/hal-02015910
Contributor : Francois Rieutord <>
Submitted on : Tuesday, February 12, 2019 - 2:45:44 PM
Last modification on : Tuesday, November 5, 2019 - 2:02:20 PM

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D. Massy, F. Mazen, J. Ragani, F. Madeira, D. Landru, et al.. Fracture Dynamics during the Silicon Layer Transfer of the Smart Cut Process. 13th International Symposium on Semiconductor Wafer Bonding - Science, Technology and Applications as part of the 226th Meeting of the Electrochem Soc, ECS, Oct 2014, Cancun, Mexico. pp.13-20, ⟨10.1149/06405.0013ecst⟩. ⟨hal-02015910⟩

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