Low defect InGaAs quantum well selectively grown by MOCVD on Si(100) 300 mm wafers for next generation non planar devices - Université Grenoble Alpes Accéder directement au contenu
Article Dans Une Revue Applied Physics Letters Année : 2014

Low defect InGaAs quantum well selectively grown by MOCVD on Si(100) 300 mm wafers for next generation non planar devices

Résumé

Metal organic chemical vapor deposition of GaAs, InGaAs, and AlGaAs on nominal 300 mm Si(100) at temperatures below 550 °C was studied using the selective aspect ratio trapping method. We clearly show that growing directly GaAs on a flat Si surface in a SiO2 cavity with an aspect ratio as low as 1.3 is efficient to completely annihilate the anti-phase boundary domains. InGaAs quantum wells were grown on a GaAs buffer and exhibit room temperature micro-photoluminescence. Cathodoluminescence reveals the presence of dark spots which could be associated with the presence of emerging dislocation in a direction parallel to the cavity. The InGaAs layers obtained with no antiphase boundaries are perfect candidates for being integrated as channels in n-type metal oxide semiconductor field effect transistor (MOSFET), while the low temperatures used allow the co-integration of p-type MOSFET.
Fichier principal
Vignette du fichier
Cipro2014.pdf (229.71 Ko) Télécharger le fichier
Origine : Fichiers produits par l'(les) auteur(s)

Dates et versions

hal-01489898 , version 1 (29-06-2021)

Licence

Paternité

Identifiants

Citer

R. Cipro, T. Baron, M. Martin, J. Moeyaert, S. David, et al.. Low defect InGaAs quantum well selectively grown by MOCVD on Si(100) 300 mm wafers for next generation non planar devices. Applied Physics Letters, 2014, 104 (26), pp.262103. ⟨10.1063/1.4886404⟩. ⟨hal-01489898⟩
332 Consultations
115 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More