300 mm InGaAs-on-insulator substrates fabricated using direct wafer bonding and the Smart Cut™ technology

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http://hal.univ-grenoble-alpes.fr/hal-01991862
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Submitted on : Thursday, January 24, 2019 - 10:23:42 AM
Last modification on : Thursday, November 21, 2019 - 2:25:45 AM

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Julie Widiez, Sébastien Sollier, Thierry Baron, Mickaël Martin, Gweltaz Gaudin, et al.. 300 mm InGaAs-on-insulator substrates fabricated using direct wafer bonding and the Smart Cut™ technology. Japanese Journal of Applied Physics, Japan Society of Applied Physics, 2016, 55 (4S), pp.04EB10. ⟨10.7567/JJAP.55.04EB10⟩. ⟨hal-01991862⟩

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