Plasma Etching Challenges for Porous SiOCH Integration In Advanced Interconnect Levels
F. Chave
(1)
,
L. Vallier
(1)
,
E. Pargon
(1)
,
O. Joubert
(1)
,
S. Barnola
(2)
,
P. Gouraud
(3)
,
C. Verove
(3)
